Copper deposition (chemical copper plating) is a chemical reaction whose main purpose is to deposit a layer of copper on the walls of the holes, which serves as a conductive lead for subsequent copper plating.
Author: Anna
The main difference between immersed copper and copper plating is the way they are realized and the purpose of their application.
Copper deposition (chemical copper plating) is a chemical reaction whose main purpose is to deposit a layer of copper on the walls of the holes, which serves as a conductive lead for subsequent copper plating. This process forms a uniform layer of copper on the circuit board substrate through a chemical reaction that relies on redox action, in which a reducing agent reduces copper ions in solution to metallic copper and deposits it on the substrate. The main function of copper deposition is to form a conductive copper layer on the circuit board substrate, which ensures the electrical conductivity of the circuit board and the correct connection of the electronic components. In addition, copper deposition technology can also replace the traditional interlayer connection technology, reduce the production cost of multilayer boards, and improve the integration and performance of PCBs.
Copper plating (electroplating), on the other hand, is an electrolytic reaction in which a layer of metallic copper is deposited on the circuit board substrate by electrolysis. This process requires the use of an electrical power source. Copper plating mainly covers the surface of the circuit board with a layer of copper, which not only improves the electrical conductivity of the circuit, but also protects the circuit board from the external environment. Copper plating is through the electrolytic effect of metal or other materials on the surface of the parts attached to a layer of metal film process, play a role in preventing metal oxidation, improve wear resistance, electrical conductivity, reflectivity and corrosion resistance.
In short, copper sinking is through a chemical reaction in the absence of current so that the copper ions reduce precipitation, mainly used in the circuit board hole wall to form a conductive layer; and copper plating is through electrolysis in the case of current will be copper ions restore and attached to the surface of the circuit board in order to improve electrical conductivity and protection. These two methods have their own advantages and disadvantages, suitable for different application scenarios.